CHIPS Incentives Program – Facilities for Semiconductor Materials and Manufacturing Equipment

National Institute of Standards and Technology · DOC

CFDA Numbers

11.037

Award Ceiling

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Award Floor

—

Expected Awards

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Close Date

Nov 1, 2026

Section I

How to Apply

Apply Online ↗

View on grants_gov ↗

Program Contact

Misty Roosa <br/>Management Analyst
apply@chips.gov

Section II

Eligibility

An applicant must be a “covered entity” to receive CHIPS Incentives. For purposes of this NOFO, a “covered entity” means a nonprofit entity; a private-sector entity; a consortium of private-sector entities; or a consortium of nonprofit, public, and private-sector entities with a demonstrated ability to substantially finance, construct, expand, or modernize a facility relating to the fabrication, assembly, testing, advanced packaging, production, or research and development of semiconductors, materials used to manufacture semiconductors or semiconductor manufacturing equipment.

Eligible Applicant Types

Section III

Description

The CHIPS Incentives Program aims to catalyze long-term economically sustainable growth in the domestic semiconductor industry in support of U.S. economic and national security. This is the second Notice of Funding Opportunity under this program and seeks applications for projects for the construction, expansion, or modernization of commercial facilities for semiconductor materials and manufacturing equipment. For more information, additional resources, and instructions on how to apply, please visit chips.gov. Note that all applications must be submitted through the CHIPS Incentives Portal at https://applications.chips.gov. If you have any questions on how to apply, please email apply@chips.gov.

Section IV

Key Dates

Posted: Sep 29, 2023
Closes: Nov 1, 2026
Archive: Dec 1, 2026